Improved trace editing: sharp angles are optimized, moving orthogonal trace with related 45 degree segments if necessary. "Do not rotate marking with component" option. Raster pictures in PCB, improved raster pictures in Schematic. Table rows and related components for report tables are highlighted.
#Patch diptrace 3.0 update#
Automatic update of report tables in PCB (BOM, Pick and Place, Drill Size, Layer Stack). Assembly variants for BOM and Pick and Place. Improved Pick and Place: Center X/Y by component outline and terminals if exist, package height, updated dialog window. Improved BOM, BOM in PCB Layout, Interactive BOM: integrated and HTML export. Improved panelizing: V-Score and Tab Routing with mouse bites.
#Patch diptrace 3.0 free#
SnapEDA Integration: free access to over 10 million DipTrace parts in a few clicks right from DipTrace UI. IPC-7351 Libraries of Con Memory Cards. Checking component prices and availability with direct links to suppliers. Downloading 3D model for SnapEDA parts, polishing SnapEDA feature. KiCAD import has been improved (KiCAD v5.99 support). LCSC Part Numbers have been added to the additional fields of the components (used by a Chinese PCB manufacturer – JLCPCB). Sensors (Magnetic, Pressure, Media Gas, Humidity, Encoders, Capacitive Touch Proximity, Image Camera, Angle Linear Position Measuring). Sensors Inertia (Accelerometers, Gyroscopes, Tilt Inclinometers) Sensors Temperature (Thermistors PTC, RTD, Analog Output, Digital Output, Voltage Current Output, Thermostats) Sensors Optical (Photodiodes, Phototransistors, Optosensors, IC Optosensors, Photoconductive Cells) Power & Protection Fuses (Chip Inch, Chip Metric, Holders, PTC Resettable) Opto Emitters LED (SMD, THT, Bi-Color, RGB, RGBW, Infrared, Ultraviolet) Sensors (Axial, Chip, Chip Corner Concave, DFN, DIP, Molded (PLCC-2), Radial Round, Radial Rectangular, SOD, SODFL, SOT, TO Cylindrical, Others) SOD, SODFL, DFN, SOL (PLCC-4, PLCC-6, PLCC-8), TO Cylindrical) Radial Round (3mm, 4mm, 5mm, 8mm, 10mm), Radial Rectangular, Radial Oval, Radial Cylindrical, LED (Axial, Chip, Chip Corner Concave, Chip Side Concave (2,4,6 Pins), Molded (PLCC-2), Submenu for creating pattern internal pad-to-pad connection (avoid accidental creation).Ĭon TB Headers (Pitch 3.50mm, 3.81mm, 5.00mm, 5.08mm, 7.62mm) ĭPAK (Pitch 1.27mm, 2.28mm, 2.29mm, 2.30mm) ĭiodes (Axial, DFN 2 Pins, DFN 3 Pins, MELF, Molded, SOD, SOFL) įuses (Chip Inch, Chip Metric, Holders, Radial Dipped Rectangular, Radial Disk) Display/Find vias by style on the layout. Side and isometric view buttons in 3D preview dialogs. Edge rail width for V-score panelizing of a rectangular board does not include the "Board to Edge/ Board to Board" gap. Continue routing option in net merge/move pad submenu. Pause routing (allows editing other traces/vias and resuming routing in one key press).
#Patch diptrace 3.0 portable#
Ability to make a portable version of the program. Environment Variables in all paths, support of related project/program paths for libraries/models/pictures. New XML format for component and pattern libraries.